3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdTpc-Documentation/Training This Test Method applies to

This Test Method applies to FPD-based stereoscopic display with passive glasses

This Specification is compatible with ISO/IEC 18000-2 except where noted

SEMI E82-1105 (technical revision)

This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications

3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdTpc-Documentation/Training This Test Method applies toPanel level packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan out technology applications. To permit common processing equipment, standardized panel (largest external) dimensions (whether with or